Indium Corporation’s Chris Nash, Product Manager PCB Assembly Materials, is on SMT007’s list of the Top 10 Most-Read Articles for March for his show floor interview at IPC APEX Expo 2019.
During the interview, Nash shared how Indium Corporation delivers electrical, mechanical, and thermal reliability to customers’ processes and end products. While achieving reliability in any of these categories can improve product performance, it does come with its own unique challenges, such as dendritic growth, harsh environments caused by high-temperature power cycling, and voiding.
Nash also discussed how Indium Corporation’s no-clean, halogen-free Indium8.9HF Solder Paste is specially formulated to address these challenges.
Nash has worked for Indium Corporation for more than 10 years and has served in a number of roles, including inside sales, product management, and global technical support. He earned his bachelor’s degree from Clarkson University and holds his Six Sigma Green Belt from Dartmouth College’s Thayer School of Engineering. He is an SMTA-Certified Process Engineer and holds certifications from the IPC for both A-600 and A-610D standards.
铟泰公司 是一家面向全球电子、半导体、薄膜及热管理 市场的顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡等金属及无机材料化合物 ；以及NanoFoil®。该公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚 、新加坡 、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
