Indium Corporation’s Chris Nash, Product Manager PCB Assembly Materials, is on SMT007’s list of the Top 10 Most-Read Articles for March for his show floor interview at IPC APEX Expo 2019.
During the interview, Nash shared how Indium Corporation delivers electrical, mechanical, and thermal reliability to customers’ processes and end products. While achieving reliability in any of these categories can improve product performance, it does come with its own unique challenges, such as dendritic growth, harsh environments caused by high-temperature power cycling, and voiding.
Nash also discussed how Indium Corporation’s no-clean, halogen-free Indium8.9HF Solder Paste is specially formulated to address these challenges.
Nash has worked for Indium Corporation for more than 10 years and has served in a number of roles, including inside sales, product management, and global technical support. He earned his bachelor’s degree from Clarkson University and holds his Six Sigma Green Belt from Dartmouth College’s Thayer School of Engineering. He is an SMTA-Certified Process Engineer and holds certifications from the IPC for both A-600 and A-610D standards.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
