Indium Corporation's Pat Ryan, America's Sales Manager, will present Voiding Under Bottom-Terminated Components at the SMTA Space Coast Expo & Tech Forum on Nov. 17 in Melbourne, Fla.
Ryan's presentation will address persistent and costly voiding problems that plague the electronics assembly industry. Topics covered will include the causes and effects of voiding, and new approaches using solder paste chemistries and readily available solder preforms to reduce voiding in BTCs.
Ryan provides strategic direction for Indium Corporation's diverse product, sales, and engineering network. He joined Indium Corporation in 1995 as a sales manager for the Western USA, and has more than 25 years of experience in the manufacturing and engineering fields. Before joining Indium Corporation, Ryan spent 10 years as a Manufacturing Engineering Manager for a medical device manufacturing company. He is an expert in providing solder solutions for customers in the electronics, semiconductor, and thermal management industries. Ryan has a bachelor's degree in mechanical engineering from the University of Portland and presently serves as the SMTA Intermountain Chapter Vice President of Technical Programs.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Elektronik-, Halbleiter-, Dünnschicht-, Wärmemanagement- und Solarmärkte. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
