Indium Corporation's Pat Ryan, America's Sales Manager, will present Voiding Under Bottom-Terminated Components at the SMTA Space Coast Expo & Tech Forum on Nov. 17 in Melbourne, Fla.
Ryan's presentation will address persistent and costly voiding problems that plague the electronics assembly industry. Topics covered will include the causes and effects of voiding, and new approaches using solder paste chemistries and readily available solder preforms to reduce voiding in BTCs.
Ryan provides strategic direction for Indium Corporation's diverse product, sales, and engineering network. He joined Indium Corporation in 1995 as a sales manager for the Western USA, and has more than 25 years of experience in the manufacturing and engineering fields. Before joining Indium Corporation, Ryan spent 10 years as a Manufacturing Engineering Manager for a medical device manufacturing company. He is an expert in providing solder solutions for customers in the electronics, semiconductor, and thermal management industries. Ryan has a bachelor's degree in mechanical engineering from the University of Portland and presently serves as the SMTA Intermountain Chapter Vice President of Technical Programs.
Indium Corporation은 전 세계 전자, 반도체, 박막, 열 관리 및 태양광 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는indiumstg.wpenginepowered.com을방문하거나[email protected]으로 이메일을 보내 주시기 바랍니다. 또한www.facebook.com/indium또는@IndiumCorp에서 당사의 전문가 그룹인 From One Engineer ToAnother®(#FOETA)를 팔로우하실 수 있습니다.
