Indium Corporation will feature its proven suite of solder pastes for reliability at the Guadalajara Expo & Tech Forum, October 23-24 in Verde Valle, Guadalajara.
Indium Corporation’s suite of solder pastes for reliability have a proven track record of eliminating common industry defects and delivering reliability in order to solve the assembly challenges of today and tomorrow.
Indium Corporation’s solder pastes, including Indium8.9HF, are specially formulated to deliver all-around reliability through ultra low-voiding, plus enhanced benefits such as improved response-to-pause, stability, head-in-pillow minimization, elimination of dendritic growth, non-wet open resistance, and enhanced solder beading performance. Indium8.9HF exceeds all requirements for enhanced electrical reliability. It also provides low voiding on bottom termination components with no dendritic growth.
For more information about Indium8.9HF and Indium Corporation’s suite of high-reliability solder pastes, visit indiumstg.wpenginepowered.com/avoidthevoid.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Märkte der Elektronik-, Halbleiter-, Dünnschicht- und Wärmemanagementindustrie. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Indien, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
