Indium Corporation will feature its proven suite of solder pastes for reliability at the Guadalajara Expo & Tech Forum, October 23-24 in Verde Valle, Guadalajara.
Indium Corporation’s suite of solder pastes for reliability have a proven track record of eliminating common industry defects and delivering reliability in order to solve the assembly challenges of today and tomorrow.
Indium Corporation’s solder pastes, including Indium8.9HF, are specially formulated to deliver all-around reliability through ultra low-voiding, plus enhanced benefits such as improved response-to-pause, stability, head-in-pillow minimization, elimination of dendritic growth, non-wet open resistance, and enhanced solder beading performance. Indium8.9HF exceeds all requirements for enhanced electrical reliability. It also provides low voiding on bottom termination components with no dendritic growth.
For more information about Indium8.9HF and Indium Corporation’s suite of high-reliability solder pastes, visit indiumstg.wpenginepowered.com/avoidthevoid.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
