Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste to help customers Avoid the Void® at IPC APEX Expo on Feb. 11-16 in San Diego, Calif.
Indium8.9HF is a no-clean, halogen-free solder paste that delivers versatility and stability in the printing process. Under optimal process conditions, Indium8.9HF:
- Zeigt bei Kühlung eine gleichbleibende Druckleistung von bis zu 12 Monaten
- Behält seine hervorragende Druck- und Reflow-Leistung bei, nachdem es einen Monat lang bei Raumtemperatur gelagert wurde
- Delivers excellent response-to-pause even after being left on the stencil for 60 hours
Indium Corporation, the industry-leading source of void-reducing materials and results, has specifically formulated Indium8.9HF solder paste to reduce voiding significantly below the industry average for improved finished goods reliability. Indium8.9HF delivers robust reflow capabilities and a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes defects.
Indium8.9HF has a unique oxidation barrier technology that makes it perfectly suited for a variety of applications, especially automotive assembly.
For more information about Indium Corporation’s low-voiding solder pastes, email [email protected] or visit www.indium.com/avoidthevoid.
Weitere Informationen über Indium Corporation erhalten Sie unter www.indium.com oder per E-Mail an [email protected]. Sie können auch unseren Experten, From One Engineer To Another® (#FOETA), unter www.facebook.com/indium oder @IndiumCorp folgen.
