Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste to help customers Avoid the Void® at IPC APEX Expo on Feb. 11-16 in San Diego, Calif.
Indium8.9HF 是一種免清洗、無鹵素的焊錫膏，能在印刷過程中提供多樣性與穩定性。在最佳製程條件下，Indium8.9HF：
- 若存放於冷藏環境中，可維持長達 12 個月的穩定列印表現
- 在室溫下放置一個月後，仍可維持優異的印刷與回流焊效能
- 即使在模板上放置 60 小時後，仍能展現出色的「按壓-暫停」反應
Indium Corporation, the industry-leading source of void-reducing materials and results, has specifically formulated Indium8.9HF solder paste to reduce voiding significantly below the industry average for improved finished goods reliability. Indium8.9HF delivers robust reflow capabilities and a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes defects.
Indium8.9HF 具備獨特的抗氧化屏障技術，使其非常適合各種應用，尤其是汽車組裝領域。
For more information about Indium Corporation’s low-voiding solder pastes, email [email protected] or visit indiumstg.wpenginepowered.com/avoidthevoid.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
