Voiding is a common problem during SMT assembly. It's something all assemblers worry about. Typically the biggest concern with the solder void is it can interfere with a component's thermal management capabilities. If proper heat transfer is not possible, a device may heat up to an unacceptable temperature, which will cause it to malfunction. The bottom line: it's reliability. Why do Indium10.1 and Indium8.9HF pastes reduce voids? Quite simply, it's the chemistry. These pastes were developed with the optimal amount of wetting, oxidation barrier and rheology so that voiding, as well as other key perimeters, are minimized. Our team is ready, willing and able to help you with our extensive process and equipment knowledge, and our void-reducing solder pastes. For more information on how Indium Corporation can help you to Avoid the Void™ visit our website at www.indium.com.
Indium10.1 and Indium8.9HF Solder Pastes Help You Avoid the Void®
Equipo de blogueros de Indium Corporation
Nuestro equipo de bloggers incluye ingenieros, investigadores, especialistas en productos y líderes del sector. Compartimos nuestra experiencia en materiales de soldadura, ensamblaje electrónico, gestión térmica y fabricación avanzada. Nuestro blog ofrece ideas, conocimientos técnicos y soluciones para inspirar a los profesionales, mostrando innovaciones de productos, tendencias y mejores prácticas para ayudar a los lectores a destacar en un sector competitivo.
