Blog

La potencia de cálculo está experimentando un fuerte crecimiento en mercados de alto rendimiento como la inteligencia artificial, los centros de datos, la computación de alto rendimiento (HPC) y la electrónica de potencia para el sector de la automoción. A medida que los dispositivos amplían los límites del rendimiento, la gestión del calor se convierte en un

Building Significant Connections What began as a fun side project from my manager, Luanne—interviewing team members to get to know the department—has blossomed into meaningful connections with

My Journey into Applications Engineering In the summer of 2024, I completed an internship in environmental health and safety (EHS) at Indium Corporation, where I spent most of my time in an office

Embracing Growth: My Daily Learning Journey Throughout my STEM internship at Indium Corporation, not a day has gone by that I haven’t learned something new. It’s a bold claim, but I know it’s

Mi experiencia previa y primeras impresiones Llegué a estas prácticas con experiencia en desarrollo de videojuegos, sin saber muy bien qué esperar ni cómo esta experiencia podría aplicarse a mi carrera profesional.

As a mechanical engineering major and mathematics minor at SUNY Polytechnic Institute, certain company names naturally become familiar over time. One of the most prominent is Indium

In my previous blog post on formic acid soldering, I explained the technology of formic acid reflow soldering, the applications in which it can be beneficial over traditional reflow soldering, the

A medida que se acercaba el primer día de mis prácticas de verano en Indium Corporation, no tenía ni idea de que un test de personalidad se convertiría en la clave para comprenderme a mí misma y al equipo que me rodeaba

Indium oxidation is not merely a surface phenomenon—it plays a critical role in the performance and reliability of high-precision applications, including semiconductors, AI, high-performance

At Indium Corporation, we understand the challenges related to power electronics assembly; devices are increasing in complexity, while demands on performance and reliability grow stronger. On top of

Amigos, la formación de bolas de soldadura durante el montaje de componentes discretos pasivos ha sido un problema desde hace décadas (véase la figura 1). El descubrimiento de que el diseño de la abertura de la plantilla tipo «home plate»

En el sector de la fabricación de productos sanitarios, donde la fiabilidad y la precisión son fundamentales, los materiales utilizados en el montaje deben cumplir con los más altos

Lograr eficiencia, fiabilidad y un rendimiento térmico excepcional es fundamental en las aplicaciones de soldadura de fijación de encapsulados para módulos de potencia. Sin embargo, las elevadas temperaturas de reflujo que requieren

A little over a year ago, I posted about the increase in interest regarding Cu sintering. In the past 12 months, that interest has surged, highlighting Cu sintering’s suitability for various

With the 4 Nations Face-Off hockey tournament held just recently in Canada and Boston, Massachusetts gained a lot of publicityfor its intensity and high level of play, and arguably pushed the NHL to

In the ever-evolving world of medical technology, quality, precision, and reliability are paramount. When it comes to manufacturing medical devices that can save lives or enhance one’s quality of

Durante mis primeras semanas como ingeniero de soporte técnico en Indium Corporation, investigué a fondo y consulté con mi equipo para averiguar cuándo se debe utilizar el fundente y por qué es esencial para

Folks, Let's see how Monica and Guy are doing in solving the too-high temperature reflow concern….. Patty was sitting in her office, and, typical to her dynamic personality, was excited and

Folks, Professor Patty Coleman is at it again. Let’s listen in….. Monica Reese was conflicted as she sat at her desk. She was excited that Professor Patty Coleman helped her get a job

Folks, I am working on a book with my Indium Corporation colleagues on tackling soldering defects in electronics.It is a follow up to our The Printed Circuits Assembler's Guide to Solder Defects.

Unlock new efficiencies in your manufacturing process with Indium Corporation’s Reclaim and Recycle Program—a visionary approach that turns post-manufacturing scrap into valuable resources.