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Computing power is surging across high-performance markets like AI, data centers, HPC, and automotive power electronics. As devices push the boundaries of performance, managing heat becomes a

Building Significant Connections What began as a fun side project from my manager, Luanne—interviewing team members to get to know the department—has blossomed into meaningful connections with

My Journey into Applications Engineering In the summer of 2024, I completed an internship in environmental health and safety (EHS) at Indium Corporation, where I spent most of my time in an office

Embracing Growth: My Daily Learning Journey Throughout my STEM internship at Indium Corporation, not a day has gone by that I haven’t learned something new. It’s a bold claim, but I know it’s

My Background and First Impressions I came into this internship with a background in game development, not entirely sure what to expect or how this experience would apply to my career

As a mechanical engineering major and mathematics minor at SUNY Polytechnic Institute, certain company names naturally become familiar over time. One of the most prominent is Indium

In my previous blog post on formic acid soldering, I explained the technology of formic acid reflow soldering, the applications in which it can be beneficial over traditional reflow soldering, the

As the first day of my summer internship at Indium Corporation approached, I had no idea that a personality quiz would become the key to understanding both myself and the team around

Indium oxidation is not merely a surface phenomenon—it plays a critical role in the performance and reliability of high-precision applications, including semiconductors, AI, high-performance

At Indium Corporation, we understand the challenges related to power electronics assembly; devices are increasing in complexity, while demands on performance and reliability grow stronger. On top of

Folks, The creation of solder balls, when assembling passive discrete components, has been an issue for decades (see Figure 1). The discovery that the “home plate” stencil aperture design

信頼性と精度が極めて重要となる医療機器製造の分野において、組み立てに使用される材料は最高水準の

パワーモジュールのパッケージ実装はんだ付けにおいて、効率性、信頼性、そして卓越した熱性能を実現することは極めて重要です。しかし、これには高いリフロー温度が必要であり、

1年ちょっと前、私は銅の焼結に対する関心の高まりについて記事を書きました。過去12か月間で、その関心はさらに高まり、銅の焼結がさまざまな用途に適していることが浮き彫りになりました。

先ごろカナダとマサチューセッツ州ボストンで開催されたホッケー大会「4 Nations Face-Off」は、その白熱した展開とハイレベルなプレーで大きな注目を集め、おそらくNHLに

絶えず進化を続ける医療技術の世界において、品質、精度、そして信頼性は何よりも重要です。人命を救ったり、生活の質を向上させたりする医療機器の製造においては、

インジウム・コーポレーションのテクニカルサポートエンジニアとして働き始めた最初の数週間、フラックスをいつ使用すべきか、またなぜそれが不可欠なのかを明らかにするために、徹底的な調査を行い、チームと協議を重ねました。

Folks, Let's see how Monica and Guy are doing in solving the too-high temperature reflow concern….. Patty was sitting in her office, and, typical to her dynamic personality, was excited and

Folks, Professor Patty Coleman is at it again. Let’s listen in….. Monica Reese was conflicted as she sat at her desk. She was excited that Professor Patty Coleman helped her get a job

皆さん、現在、インジウム・コーポレーションの同僚たちと、電子機器におけるはんだ付け不良への対処法に関する本を執筆中です。これは、私たちの著書『プリント基板組立担当者向けはんだ付け不良ガイド』の続編となります。

Unlock new efficiencies in your manufacturing process with Indium Corporation’s Reclaim and Recycle Program—a visionary approach that turns post-manufacturing scrap into valuable resources.