Indium Corporation Regional Technical Manager and Technologist Advanced Applications Andreas Karch is set to present as part of the upcoming IMAPS Spring Seminar, March 23, in Ilmenau, Germany. The 2023 Spring Seminar will focus on sustainability in electronics production.
Andreas’ presentation will address energy efficiency in reflow soldering processes enabled by a new, low-temperature composite alloy. Additionally, he will cover its desirable mechanical properties also confirmed in multiple verticals.
Andreas provides technical support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials for customers in Germany, Austria, and Switzerland. Products include solder paste, solder preforms, fluxes, and thermal management materials. He has more than 20 years of automotive industry experience in PCB assembly and power electronics, including the advanced development of customized electronics. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Andreas is an ECQA-certified integrated design engineer and earned his Six Sigma Yellow Belt. His thorough understanding of process technologies and project management skills reinforce Indium Corporation’s commitment to providing world-class service to our customers in Europe.
Acerca de Indium Corporation
Indium Corporation es un importante refinador, fundidor, fabricante y proveedor de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, Alemania, India, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
For more information about Indium Corporation, visit www.indium.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp
About IMAPS
The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through premier professional events, an exclusive microelectronics packaging research library, local chapter networks, and other efforts. Founded in 1967 as ISHM, then merging with the International Electronic and Packaging Society (IEPS) in 1996, the Society has over 50 years of networking, education, and publication history.
