Indium Corporation will feature void-reducing Indium8.9HF, a halogen-free, no-clean solder paste, at Productronica 2015, Nov. 10-13, in Munich, Germany.
Indium8.9HF is specifically formulated to reduce voiding, while delivering high transfer efficiency with low variability. In addition to outstanding print transfer and excellent response-to-pause, this no-clean solder paste also provides excellent pin-in-paste solderability and hole-fill, while remaining stable at room temperature for up to 30 days.
Indium8.9HF is perfectly suited for a variety of applications, especially automotive, due to its unique oxidation barrier technology. This solder paste delivers robust reflow capability from a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes potential defects.
Indium8.9HF solder paste is part of Indium Corporation's family of high-performance, lead-free, low-voiding, no-clean solder pastes. For more information about Indium8.9HF, email [email protected], visit indiumstg.wpenginepowered.com/productronica-germany-2015, or stop by Indium Corporation's stand in Hall A4 at booth #214.
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