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Indium Corporation Hires New Technical Support Engineer for Global Accounts Group

Several Indium Corporation experts will share their knowledge and expertise at the SMTA International Conference Sept. 27-Oct. 1 in Rosemont, Ill.

The following six technical papers from Indium Corporation experts will be featured:

  • Novel Lead-Free Solder Alloy Development for Automotive Applications by Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Weiping Liu, Research Metallurgist;
  • Partially-Dried No-Clean Flux At Under-Component Terminations: Risks and Solutions by Dr. Lee and Fen Chen, Bench Chemist;
  • A Comparison of Rosin-Based vs. Non-Rosin-Based Wave Soldering Fluxes by Dr. Ron Lasky, Senior Technologist; and Adam Murling, Technical Support Engineer;
  • Determination of Total Halogen Content in Halogen-Free Fluxes by Inductively-Coupled Plasma and Some Limitations of Ion Chromatography by Dr. Lasky and Christopher Pontius, Organic Lab Chemist;
  • Improvements in Voiding and Reliability of BTCs by Derrick Herron, Technical Support Engineer; Christopher Nash, PCBA New Product Development Manager; Raymond Luo, Area Technical Manager – South China; and Andy Wei, Assistant Technical Manager;
  • iNEMI Pb-Free Alloy Characterization Project Report: Part IX – Summary of the Effect of Isothermal Preconditioning on Thermal Fatigue Life by Liu, and several co-authors and industry colleagues.

Indium Corporation experts will also serve as chairs for four sessions, including:

  • New Developments in No-Clean Solder Paste and Flux Technology and Reliability with Eric Bastow, Assistant Technical Manager;
  • Solder Joint Reliability Assessment with Tim Jensen, Senior Product Manager for Engineered Solders;
  • BGA Reliability with Derrick Herron, Technical Support Engineer for the Northeastern USA and Canada;
  • Challenges in Advanced Package-on-Package Applications with Greg Wade, Global Technical Support Engineer.

SMTAI is a world-class electronics manufacturing conference and exhibition organized by the SMTA — the world's leading user group for surface mount and companion technologies. The conference provides high-quality technical information and networking opportunities.

Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, la energía solar, la capa fina y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil®. Fundada en 1934, Indium cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.

Para más información sobre Indium Corporation, visite www.indium.com o envíe un correo electrónico a [email protected]. También puede seguir a nuestros expertos, From One Engineer To Another® (#FOETA), en www.facebook.com/indium o @IndiumCorp.