Several Indium Corporation experts will share their knowledge and expertise at the SMTA International Conference Sept. 27-Oct. 1 in Rosemont, Ill.
The following six technical papers from Indium Corporation experts will be featured:
- Novel Lead-Free Solder Alloy Development for Automotive Applications by Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Weiping Liu, Research Metallurgist;
- Partially-Dried No-Clean Flux At Under-Component Terminations: Risks and Solutions by Dr. Lee and Fen Chen, Bench Chemist;
- A Comparison of Rosin-Based vs. Non-Rosin-Based Wave Soldering Fluxes by Dr. Ron Lasky, Senior Technologist; and Adam Murling, Technical Support Engineer;
- Determination of Total Halogen Content in Halogen-Free Fluxes by Inductively-Coupled Plasma and Some Limitations of Ion Chromatography by Dr. Lasky and Christopher Pontius, Organic Lab Chemist;
- Improvements in Voiding and Reliability of BTCs by Derrick Herron, Technical Support Engineer; Christopher Nash, PCBA New Product Development Manager; Raymond Luo, Area Technical Manager – South China; and Andy Wei, Assistant Technical Manager;
- iNEMI Pb-Free Alloy Characterization Project Report: Part IX – Summary of the Effect of Isothermal Preconditioning on Thermal Fatigue Life by Liu, and several co-authors and industry colleagues.
Indium Corporation experts will also serve as chairs for four sessions, including:
- New Developments in No-Clean Solder Paste and Flux Technology and Reliability with Eric Bastow, Assistant Technical Manager;
- Solder Joint Reliability Assessment with Tim Jensen, Senior Product Manager for Engineered Solders;
- BGA Reliability with Derrick Herron, Technical Support Engineer for the Northeastern USA and Canada;
- Challenges in Advanced Package-on-Package Applications with Greg Wade, Global Technical Support Engineer.
SMTAI is a world-class electronics manufacturing conference and exhibition organized by the SMTA — the world's leading user group for surface mount and companion technologies. The conference provides high-quality technical information and networking opportunities.
Indium Corporation 是全球电子、半导体、太阳能、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。Indium 公司成立于 1934 年，在中国、马来西亚、新加坡、韩国、英国和美国拥有全球性的技术支持和工厂。
有关 Indium Corporation 的更多信息，请访问www.indium.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家 From One Engineer ToAnother®(#FOETA) 。
