Several Indium Corporation experts will share their knowledge and expertise at the SMTA International Conference Sept. 27-Oct. 1 in Rosemont, Ill.
The following six technical papers from Indium Corporation experts will be featured:
- Novel Lead-Free Solder Alloy Development for Automotive Applications by Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Weiping Liu, Research Metallurgist;
- Partially-Dried No-Clean Flux At Under-Component Terminations: Risks and Solutions by Dr. Lee and Fen Chen, Bench Chemist;
- A Comparison of Rosin-Based vs. Non-Rosin-Based Wave Soldering Fluxes by Dr. Ron Lasky, Senior Technologist; and Adam Murling, Technical Support Engineer;
- Determination of Total Halogen Content in Halogen-Free Fluxes by Inductively-Coupled Plasma and Some Limitations of Ion Chromatography by Dr. Lasky and Christopher Pontius, Organic Lab Chemist;
- Improvements in Voiding and Reliability of BTCs by Derrick Herron, Technical Support Engineer; Christopher Nash, PCBA New Product Development Manager; Raymond Luo, Area Technical Manager – South China; and Andy Wei, Assistant Technical Manager;
- iNEMI Pb-Free Alloy Characterization Project Report: Part IX – Summary of the Effect of Isothermal Preconditioning on Thermal Fatigue Life by Liu, and several co-authors and industry colleagues.
Indium Corporation experts will also serve as chairs for four sessions, including:
- New Developments in No-Clean Solder Paste and Flux Technology and Reliability with Eric Bastow, Assistant Technical Manager;
- Solder Joint Reliability Assessment with Tim Jensen, Senior Product Manager for Engineered Solders;
- BGA Reliability with Derrick Herron, Technical Support Engineer for the Northeastern USA and Canada;
- Challenges in Advanced Package-on-Package Applications with Greg Wade, Global Technical Support Engineer.
SMTAI is a world-class electronics manufacturing conference and exhibition organized by the SMTA — the world's leading user group for surface mount and companion technologies. The conference provides high-quality technical information and networking opportunities.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
