As one of the leading materials providers in the electronics assembly and solder industries, Indium Corporation® is proud to feature its lineup of high-reliability products at APEC 2025, taking place March 16-20, in Atlanta, Georgia.
With a strong focus on power device packaging, Indium Corporation provides advanced material solutions engineered to enhance energy efficiency, optimize thermal management, and support long-term sustainability in electrification applications. A key part of this innovation is Indium Corporation’s Fluxless Assembly Solder Technology (FAST), which enables high-reliability, flux-free soldering solutions tailored for next-generation power electronics.
Indium Corporation exhibirá entre sus productos destacados los siguientes:
- Award-winning InFORMS® are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications.
- InTACK® esuna solución adhesiva que no requiere limpieza, no deja residuos y no contiene halógenos, desarrollada para mantener las piezas en su sitio durante los procesos de colocación y reflujo.
- Indalloy®301LT for Preforms/InFORMS® is a novel Pb-free alloy that enables lower reflow processing temperatures compared to SAC alloys, preventing delamination and reducing warpage in package-attach soldering applications.
- Indalloy®276 is a unique lead-free solder alloy that offers a wide service temperature capability and improved reliability up to 175°C. It has demonstrated high-reliability performance while also being capable at both moderate and high service temperature conditions
- Durafuse® HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
- Durafuse® HT esuna innovadora solución sin plomo diseñada para ofrecer una pasta sin plomo para altas temperaturas (HTLF) destinada a dispositivos discretos de electrónica de potencia.Durafuse® HT puedeintegrarse directamente en el proceso actual de pasta de fijación de chips con alto contenido en plomo, sin necesidad de equipamiento especial. Tanto el rendimiento funcional como la fiabilidad frente a los ciclos térmicos son iguales o superiores a los de una soldadura con alto contenido en plomo.
- QuickSinter® is a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput. Both silver and copper sinter pastes are available. Applications include die-attach and substrate-attach in power electronics. The portfolio includes the InFORCE™ range of pressure sinter pastes:
- InFORCE® 29 – a pressure copper sinter paste for high-reliability, high thermal conductivity, die-attach applications; InFORCE™29 features high workability, making it suitable for printing or dispensing applications.
- InFORCE® MF – a pressure silver sinter paste for the highest reliability, highest thermal conductivity, die-attach applications; InFORCE™MF is specially formulated for printing applications, providing low process yield loss due to print defects.
- InFORCE® LA – a pressure silver sinter paste formulated for sintering of areas greater than 100mm2. Sintering is possible with reduced temperatures and pressure, making it suitable for transferring molded package-attach to cooler applications.
To learn more about Indium Corporation’s power electronics and solder solutions, visit indiumstg.wpenginepowered.com or visit our experts at APEC at booth #404.
Acerca de Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
Para obtener más información sobre Indium Corporation, visita indiumstg.wpenginepowered.com o envía un correo electrónico a [email protected]. También puedes seguir a nuestros expertos, From One Engineer ToAnother® (#FOETA), en www.linkedin.com/company/indium-corporation/.
