Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager, Semiconductor and Advanced Assembly Materials, will present at Advanced Driver Assistance Systems (ADAS), April 4-5 in Detroit, Mich.
Dr. Mackie will discuss Heterogenous Integration and Assembly (HIA). Indium Corporation is heavily involved in developing materials for HIA. The company offers solder pastes, fluxes, and innovative materials that enable the assembly of a wide variety of die and components in 2.5D and 3D, multichip modules (MCM), and system-in-package (SiP). Dr Mackie’s presentation will detail Indium Corporation’s capabilities in water-soluble and ultralow residue no-clean assembly materials for both high- and low-melting applications, such as printing (including ultrafine pitch), dispensing, and jetting.
Dr. Mackie is an electronics industry expert in physical chemistry, surface chemistry, rheology, and semiconductor assembly materials and processes. He has more than 20 years of experience in new product and process development, and materials marketing in all areas of electronics manufacturing, from wafer fabrication to semiconductor packaging and electronics assembly. Dr. Mackie has a doctorate in physical chemistry from the University of Nottingham, U.K., and a Master of Science in Colloid and Interface Science from the University of Bristol, U.K. He is also formally trained in Six Sigma – Design of Experiments.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes, soldaduras fuertes, materiales de interfaz térmica, cátodos para sputtering, metales y compuestos inorgánicos de indio, galio, germanio y estaño, y NanoFoil®. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
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