Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager, Semiconductor and Advanced Assembly Materials, will present at Advanced Driver Assistance Systems (ADAS), April 4-5 in Detroit, Mich.
Dr. Mackie will discuss Heterogenous Integration and Assembly (HIA). Indium Corporation is heavily involved in developing materials for HIA. The company offers solder pastes, fluxes, and innovative materials that enable the assembly of a wide variety of die and components in 2.5D and 3D, multichip modules (MCM), and system-in-package (SiP). Dr Mackie’s presentation will detail Indium Corporation’s capabilities in water-soluble and ultralow residue no-clean assembly materials for both high- and low-melting applications, such as printing (including ultrafine pitch), dispensing, and jetting.
Dr. Mackie is an electronics industry expert in physical chemistry, surface chemistry, rheology, and semiconductor assembly materials and processes. He has more than 20 years of experience in new product and process development, and materials marketing in all areas of electronics manufacturing, from wafer fabrication to semiconductor packaging and electronics assembly. Dr. Mackie has a doctorate in physical chemistry from the University of Nottingham, U.K., and a Master of Science in Colloid and Interface Science from the University of Bristol, U.K. He is also formally trained in Six Sigma – Design of Experiments.
铟泰公司 是一家面向全球电子、半导体、薄膜及热管理 市场的顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡等金属及无机材料化合物 ；以及NanoFoil®。该公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚 、新加坡 、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
