Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager, Semiconductor and Advanced Assembly Materials, will present at Advanced Driver Assistance Systems (ADAS), April 4-5 in Detroit, Mich.
Dr. Mackie will discuss Heterogenous Integration and Assembly (HIA). Indium Corporation is heavily involved in developing materials for HIA. The company offers solder pastes, fluxes, and innovative materials that enable the assembly of a wide variety of die and components in 2.5D and 3D, multichip modules (MCM), and system-in-package (SiP). Dr Mackie’s presentation will detail Indium Corporation’s capabilities in water-soluble and ultralow residue no-clean assembly materials for both high- and low-melting applications, such as printing (including ultrafine pitch), dispensing, and jetting.
Dr. Mackie is an electronics industry expert in physical chemistry, surface chemistry, rheology, and semiconductor assembly materials and processes. He has more than 20 years of experience in new product and process development, and materials marketing in all areas of electronics manufacturing, from wafer fabrication to semiconductor packaging and electronics assembly. Dr. Mackie has a doctorate in physical chemistry from the University of Nottingham, U.K., and a Master of Science in Colloid and Interface Science from the University of Bristol, U.K. He is also formally trained in Six Sigma – Design of Experiments.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
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