Indium Corporation, Kyzen Corporation, Heller Industries, Inc., and MBtech Group hosted a technical conference on Oct. 17 in Melaka, Malaysia.
The conference featured technical presentations from Sze Pei Lim, Indium Corporation's technical manager for Southeast Asia. It also included presentations by Jason Chan, technical applications manager for Kyzen; Benoit Fillastre, international sales manager for MBtech; and SS Kwa, director of Southeast Asia sales for Heller Industries.
Sze Pei's presentation, Sharing Indium Corporation's Technical Roadmap, discussed the current and future development of Indium Corporation's semiconductor products, including the award-winning SACm™ solder alloy and BiAgX® solder paste technology, and products in development.
Sze Pei joined Indium Corporation in 2007. She manages the company's technical service teams throughout the Asia-Pacific region. Sze Pei is also the manager of Indium Corporation's Tech Hub – the company's regional center for the development of assembly expertise and customer service. She earned her bachelor's degree in chemistry from the National University of Singapore, and has more than 20 years of experience in the SMT and PCB assembly industries. Sze Pei is an SMTA-certified process engineer and has earned her Six Sigma Green Belt.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, la energía solar, la capa fina y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil®. Fundada en 1934, Indium cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
