Indium Corporation, Kyzen Corporation, Heller Industries, Inc., and MBtech Group hosted a technical conference on Oct. 17 in Melaka, Malaysia.
The conference featured technical presentations from Sze Pei Lim, Indium Corporation's technical manager for Southeast Asia. It also included presentations by Jason Chan, technical applications manager for Kyzen; Benoit Fillastre, international sales manager for MBtech; and SS Kwa, director of Southeast Asia sales for Heller Industries.
Sze Pei's presentation, Sharing Indium Corporation's Technical Roadmap, discussed the current and future development of Indium Corporation's semiconductor products, including the award-winning SACm™ solder alloy and BiAgX® solder paste technology, and products in development.
Sze Pei joined Indium Corporation in 2007. She manages the company's technical service teams throughout the Asia-Pacific region. Sze Pei is also the manager of Indium Corporation's Tech Hub – the company's regional center for the development of assembly expertise and customer service. She earned her bachelor's degree in chemistry from the National University of Singapore, and has more than 20 years of experience in the SMT and PCB assembly industries. Sze Pei is an SMTA-certified process engineer and has earned her Six Sigma Green Belt.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持体系，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
