Indium Corporation, Kyzen Corporation, Heller Industries, Inc., and MBtech Group hosted a technical conference on Oct. 17 in Melaka, Malaysia.
The conference featured technical presentations from Sze Pei Lim, Indium Corporation's technical manager for Southeast Asia. It also included presentations by Jason Chan, technical applications manager for Kyzen; Benoit Fillastre, international sales manager for MBtech; and SS Kwa, director of Southeast Asia sales for Heller Industries.
Sze Pei's presentation, Sharing Indium Corporation's Technical Roadmap, discussed the current and future development of Indium Corporation's semiconductor products, including the award-winning SACm™ solder alloy and BiAgX® solder paste technology, and products in development.
Sze Pei joined Indium Corporation in 2007. She manages the company's technical service teams throughout the Asia-Pacific region. Sze Pei is also the manager of Indium Corporation's Tech Hub – the company's regional center for the development of assembly expertise and customer service. She earned her bachelor's degree in chemistry from the National University of Singapore, and has more than 20 years of experience in the SMT and PCB assembly industries. Sze Pei is an SMTA-certified process engineer and has earned her Six Sigma Green Belt.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
