Die-Attach

Die-attach involves securing semiconductor dies—typically Si, SiC, GaAs, or GaN—to a lead frame or substrate. This step is essential in establishing a mechanically reliable interconnection while also ensuring that the thermal and electrical properties meet the application’s requirements. Required levels of reliability, thermal conductivity, and electrical conductivity vary across applications, highlighting the importance of selecting the most suitable die-attach material. As a trusted partner in optimizing existing processes and developing innovative solutions, Indium Corporation offers a wide range of die-attach solutions from solder paste, to specialty preforms, to sinter materials.

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Close-up of a semiconductor die being precisely soldered by a robotic arm, showcasing advanced die bonding techniques.

Various types of electronic transistors, a circuit board, and a semiconductor die on a white background.

Overview

Revolutionizing Semiconductor Die-Attach Materials for High-Power Devices

Die-attach for high-power devices, such as IGBTs and emerging wide bandgap semiconductors, face increasing challenges related to service temperature, power density, and reliability. Traditional high-lead solder materials are reaching their performance limits, but we have developed—and continue to innovate— advanced lead-free semiconductor die-attach materials to overcome current and future challenges.

Benefits

High Reliability, Thermal Conductivity, and Electrical Conductivity Across Various Applications

Low Voiding

Our die-attach solutions offer exceptional performance in reducing voids, guaranteeing optimal thermal performance for the application.

High-Reliability Alloys

We offer a wide range of dependable alloys for solder pastes and preforms that meet or surpass industry standards.

Customization

We work closely with our customers and partners to provide tailored soldering solutions for die-attach applications that meet their specific requirements.

Technical Expertise

With profound knowledge and extensive experience in die attach and related materials, our global team of technical experts is ready to offer valuable guidance and support for your project.

Choose the Right Materials for Die-Attach Semiconductor Applications

You can choose from a variety of materials for die-attach processes, including high-temperature solder pastes and gold-based solders. Each option offers distinct advantages and trade-offs, requiring careful evaluation based on the specific application requirements. We offer a range of proven products and solutions to help our customers make the best choice for their needs.

Gold-based Solders

These materials are ideal for costly high-reliability applications, such as aerospace and military, where excellent thermal and electrical conductivity is required.

Sintering

Typically used in high-performance applications, sintering provides excellent thermal and electrical conductivity together with enhanced reliability and durability, making it the ideal choice for WBG semiconductors in power electronics.

High-Temperature Solder Paste

Commonly used in die-on-leadframe applications, solder die attach serves as the mechanical bond between the die and leadframe while also aiding heat dissipation. Paste flux options range from traditional rosin based to ultra-low residue. Alloys include Pb-based, low alpha Pb-based and innovative Pb-free solutions like Durafuse®HT.

Preforms

These products are suitable for applications that require precise material control, such as automated manufacturing. Custom tooling and design may also be necessary. We offer both standard and custom preforms tailored to specific requirements. Our patented InFORMS® technology, which is known for enhancing bondline control and reliability, is preferred for applications that demand precision.

Related Products

Indium Corporation offers a full line of wave fluxes that can meet the needs of numerous selective soldering applications. For example, the WF-9948 flux is excellent for those applications where reliability and minimal post-soldering residues are required.