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Indium Corporation to Exhibit Industry-Leading EV Products at Productronica

Indium Corporation is proud to showcase its proven advanced assembly materials for PCBA and power electronics, including those for the rapidly evolving electric vehicle manufacturing and e-Mobility market, at Productronica, November 14-17, in Munich, Germany.

With its significant automotive industry expertise and an award-winning portfolio of proven products, Indium Corporation will feature its Rel-ion suite of electrical, mechanical, and thermal solutions to reduce electric vehicle (EV) manufacturers’ time to market. 

 

More than four million EVs are on the road with Indium Corporation’s reliable, scalable, and proven Rel-ion products. Rel-ion materials solutions deliver reliability by:

  • 消除非濕式開啟和頭枕式缺陷
  • 符合更嚴格的表面絕緣電阻要求,防止樹枝狀生長
  • 透過精確的接合線控制防止焊料脫層,並提高抗蠕變和抗疲勞能力
  • 透過改善熱效率,減少熱點引起的空洞

Some of the Rel-ion products featured at productronica include:

  • Indalloy301LT 爐胚合金/InFORMS嶄新的無鉛合金,與 SAC 合金相比,可降低爐胚焊接的加工溫度。此合金專為電源模組應用而設計,可防止封裝與冷卻器連接時產生翹曲,而不會像傳統含鉍低溫合金一樣犧牲可靠性。可提供預型件、帶狀或 InFORMS
  • 屢獲殊榮的 InFORMS強化焊料合金製品,可提高機械和熱穩定性,專門設計用於產生一致的邦定線厚度,適用於功率模組應用。它們也能解決電力電子產業所面臨的特殊挑戰,為開發更可靠、更高效能的模組提供強化材料。
  • InTACK是一款免清洗、無殘留、無鹵素的粘合劑解決方案,專為在貼片和回流焊製程中固定零件而開發。InTACK 專為使用甲酸的無流回流應用而設計,具有高黏性的特殊配方,可固定晶粒、晶片或預型焊料而不會移動,減少對工具的依賴,同時不會影響焊接或燒結的品質。
  • QuickSinter  a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput. Both silver and copper sinter pastes are available. The portfolio includes the InFORCE range of pressure sinter pastes and the InBAKE range of pressure-less sinter pastes. Applications include die attach and substrate attach in power electronics.
  • 屢獲殊榮的 Durafuse LT是一種新穎的焊膏混合合金系統,具有高度多樣化的特性,使其能夠用於節能、高可靠性、低溫、階段焊接以及具有大溫度梯度的組裝。與傳統低溫焊錫相比,它還能提供優異的跌落衝擊性能,超越 BiSn 或 BiSnAg 合金,在最佳製程設定的情況下,性能更優於 SAC305。
  • Durafuse HR  based on a novel alloy technology, delivers enhanced thermal cycling performance (-40/125C and -40/150C) and superior voiding performance for high reliability automotive applications.
  • Indium8.9HF 焊膏系列是經過業界驗證的焊膏系列,提供免清洗、無鹵素的解決方案,可達到高表面絕緣電阻 (SIR),並提高印刷製程中的穩定性,適用於高可靠性的汽車電子產品。

To learn more about why over four million electric vehicles are on the road with Indium Corporation’s innovative materials, visit booth #A4.309 or indium.com/emobility.  

關於 Indium Corporation

Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑;銅钎;熱介面材料;濺鍍靶材;铟、鎵、锗、錫金屬和無機化合物;以及 NanoFoil 。公司成立於 1934 年,擁有全球性的技術支援,工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。

如需更多關於 Indium Corporation 的資訊,請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以在www.linkedin.com/company/indium-corporation/ 追蹤我們的專家,From One Engineer To Another (#FOETA)。