As one of the leading materials providers to the power electronics assembly industry, Indium Corporation will proudly showcase a selection of innovative products at PCIM Europe, May 9-11, in Nuremberg, Germany. Indium Corporation’s products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.
Featured products include:
- InTACK是一款免清洗、無殘留、無鹵素的粘合劑解決方案，專為在貼片和回流焊製程中固定零件而開發。InTACK 專為使用甲酸的無流回流應用而設計，具有高黏性的特殊配方，可固定晶粒、晶片或預型焊料而不會移動，減少對工具的依賴，同時不會影響焊接或燒結的品質。
- InFORMS reinforced solder alloy fabrications that improve mechanical and thermal reliability and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
- Indalloy301LT 爐胚合金/InFORMS嶄新的無鉛合金，與 SAC 合金相比，可降低爐胚焊接的加工溫度。此合金專為電源模組應用而設計，可防止封裝與冷卻器連接時產生翹曲，而不會像傳統含鉍低溫合金一樣犧牲可靠性。可提供預型件、帶狀或 InFORMS 。
- InFORCE29 a pressure copper sinter paste for high-reliability, high thermal conductivity, die-attach applications, InFORCE29 features high workability, making it suitable for printing or dispensing applications. InFORCE29 provides excellent sinter performance on bare copper surfaces without the need for costly gold or silver plating.
- InFORCEMF a pressure silver sinter paste for the highest reliability, highest thermal conductivity, die-attach applications, InFORCEMF is specially formulated for printing applications providing low process yield loss due to print defects and reduces the need for overprint. With a high metal load and low organic content, it enables fast drying times and less material loss.
- Durafuse HT based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys. Durafuse HT delivers simplified processing, with no special equipment needed, and enhanced thermal cycling reliability equal to or higher than a high-Pb solder.
如欲進一步瞭解 Indium Corporation 的電力電子解決方案，請務必蒞臨 6 號展覽廳 460 號攤位的 PCIM 與我們的專家會面。
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家，From One Engineer To Another (#FOETA)。
關於 PCIM 歐洲
PCIM Europe is the leading international exhibition for the community of power electronics and its applications. The event offers an international audience the opportunity to learn about products throughout the entire value chain, discover the latest trends, and exchange ideas with experts from all over the world.
