Four Indium Corporation experts will present at SMTA International, September 22-26, in Rosemont, Illinois, USA.
Dr. Ning-Cheng Lee, Vice President of Technology, will lead a professional workshop on Novel Fluxes with Decreased Viscosity After Reflow for Flip-Chip and SiP Assembly. He will explain the development of fluxes for flip-chip and SiP assembly. These high-viscosity, high-tack fluxes are designed to be used to secure components at the placement and reflow stage allowing the flux residue to be cleaned.
Dr. Lee will also present Fluxes Designed for Suppressing Non-Wet-Open during BGA Assembly, which examines the increasing severity of warpage and non-wet-open (NWO) defects during BGA assembly due to the continuing advancement of miniaturization. He will discuss how a “cold-welding barrier” method utilizing a flux coating has been developed to suppress NWO defects.
Additionally, Dr. Lee will lead the professional development course, Achieving High-Reliability for Lead-Free Solder Joints – Materials Consideration. The goal of this course is to provide participants with the understanding of how various factors contribute to failure modes, and how to select proper solder alloys and surface finishes for achieving high-reliability.
Kenneth Thum, Senior Technical Support Engineer, will present Ultrafine Solder Paste Dispensing for Heterogeneous Integration. The paper examines how heterogeneous integration for advanced packaging is driving the need for ultrafine solder paste dispensing in tightly packed components where printing is not possible. Thum will offer solutions on how to achieve consistent fine-dot printing, including examining different dispensing equipment technologies and important solder paste characteristics.
Indium Corporation experts will also co-chair two sessions during the conference:
- Adam Murling, Technical Support Engineer, Global Accounts, will chair a Manufacturing Excellence Track session on Stencils & Printing.
- Tim Jensen, Product Manager for Engineered Solder Materials, will co-chair an Advanced Packaging Technology Track session on Advanced Packaging.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has more than three decades in the development of fluxes, alloys and solder pastes for SMT industries and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials. Dr. Lee has published articles in numerous industry publications and is frequently an invited speaker for presentations, seminars, keynote speeches, and short courses worldwide, many of which have been recognized with “Best of Conference” awards.
Thum provides technical support and process troubleshooting expertise to Indium Corporation’s customers. His experience involves delivering yield improvements and enhanced supplier quality. Thum earned his bachelor’s degree in computer-aided design and computer-aided manufacturing from the University of Malaya. Additionally, he is an SMTA-certified process engineer.
Murling is responsible for providing leading-edge technical support for Indium Corporation’s global account initiatives through SMT process optimization, material recommendations, and customer training. He is an active blogger and has authored numerous technical papers. He earned his bachelor’s degree in chemical engineering from Clarkson University.
Jensen ist ein SMTA-zertifizierter Prozessingenieur. Er verfügt über mehr als 20 Jahre Erfahrung in der Zusammenarbeit mit Kunden bei der Fehlersuche und Optimierung von SMT-Prozesslinien und der Behebung von Defekten wie Head-in-Pillow, Graping und QFN-Voiding. Jensen hat direkt an Hunderten von Oberflächenmontageanlagen gearbeitet und eine Reihe verschiedener Produkte entwickelt. Auf der Grundlage dieser direkten Kenntnisse und Erfahrungen arbeitet er eng mit dem technischen Service, dem Vertrieb sowie den Forschungs- und Entwicklungsteams von Indium Corporation zusammen, um innovative Produkte zu entwickeln, die den besonderen Herausforderungen der Elektronikmontagebranche gerecht werden. Als Senior Product Manager ist Jensen für die vielfältigste Produktgruppe der Indium Corporation verantwortlich, die Lötvorformlinge, Draht, Bänder und Folien sowie Materialien für thermische Schnittstellen umfasst. Er erwarb seinen Bachelor-Abschluss in Chemietechnik an der Clarkson University und seinen Master-Abschluss in Betriebswirtschaft an der Syracuse University.
Weitere von den Experten der Indium Corporation verfasste Dokumente finden Sie unter www.indium.com/techlibrary.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Märkte der Elektronik-, Halbleiter-, Dünnschicht- und Wärmemanagementindustrie. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Indien, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den USA.
Weitere Informationen über Indium Corporation erhalten Sie unter www.indium.com oder per E-Mail an [email protected]. Sie können auch unseren Experten, From One Engineer To Another® (#FOETA), unter www.facebook.com/indium oder @IndiumCorp folgen.
