Four Indium Corporation experts will present at SMTA International, September 22-26, in Rosemont, Illinois, USA.
Dr. Ning-Cheng Lee, Vice President of Technology, will lead a professional workshop on Novel Fluxes with Decreased Viscosity After Reflow for Flip-Chip and SiP Assembly. He will explain the development of fluxes for flip-chip and SiP assembly. These high-viscosity, high-tack fluxes are designed to be used to secure components at the placement and reflow stage allowing the flux residue to be cleaned.
Dr. Lee will also present Fluxes Designed for Suppressing Non-Wet-Open during BGA Assembly, which examines the increasing severity of warpage and non-wet-open (NWO) defects during BGA assembly due to the continuing advancement of miniaturization. He will discuss how a “cold-welding barrier” method utilizing a flux coating has been developed to suppress NWO defects.
Additionally, Dr. Lee will lead the professional development course, Achieving High-Reliability for Lead-Free Solder Joints – Materials Consideration. The goal of this course is to provide participants with the understanding of how various factors contribute to failure modes, and how to select proper solder alloys and surface finishes for achieving high-reliability.
Kenneth Thum, Senior Technical Support Engineer, will present Ultrafine Solder Paste Dispensing for Heterogeneous Integration. The paper examines how heterogeneous integration for advanced packaging is driving the need for ultrafine solder paste dispensing in tightly packed components where printing is not possible. Thum will offer solutions on how to achieve consistent fine-dot printing, including examining different dispensing equipment technologies and important solder paste characteristics.
Indium Corporation experts will also co-chair two sessions during the conference:
- Adam Murling, Technical Support Engineer, Global Accounts, will chair a Manufacturing Excellence Track session on Stencils & Printing.
- Tim Jensen, Product Manager for Engineered Solder Materials, will co-chair an Advanced Packaging Technology Track session on Advanced Packaging.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has more than three decades in the development of fluxes, alloys and solder pastes for SMT industries and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials. Dr. Lee has published articles in numerous industry publications and is frequently an invited speaker for presentations, seminars, keynote speeches, and short courses worldwide, many of which have been recognized with “Best of Conference” awards.
Thum provides technical support and process troubleshooting expertise to Indium Corporation’s customers. His experience involves delivering yield improvements and enhanced supplier quality. Thum earned his bachelor’s degree in computer-aided design and computer-aided manufacturing from the University of Malaya. Additionally, he is an SMTA-certified process engineer.
Murling is responsible for providing leading-edge technical support for Indium Corporation’s global account initiatives through SMT process optimization, material recommendations, and customer training. He is an active blogger and has authored numerous technical papers. He earned his bachelor’s degree in chemical engineering from Clarkson University.
Jensen 是 SMTA 认证的工艺工程师。他拥有 20 多年与客户一起排除故障、优化 SMT 工艺线和解决缺陷（如枕形头、刻蚀和 QFN 失效）的工作经验。Jensen 直接参与了数百条表面贴装生产线的工作，并开发了许多不同的产品。利用这些直接的知识和专长，他与 Indium Corporation 的技术服务、销售和研发团队密切合作，开发尖端产品，以应对电子组装行业面临的独特挑战。作为高级产品经理，Jensen 负责 Indium Corporation 最多样化的产品组，包括焊料预制件、线材、带材和箔材以及热界面材料。他拥有克拉克森大学化学工程学士学位和锡拉丘兹大学工商管理硕士学位。
To view additional papers authored by Indium Corporation's experts, visit www.indium.com/techlibrary.
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。公司成立于 1934 年，拥有全球技术支持，在中国、印度、马来西亚、新加坡、韩国、英国和美国均设有工厂。
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