Indium Corporation’s Brook Sandy-Smith, Product Support Specialist – PCB Assembly Materials, will present at the Business Electronic Soldering Technologies (BEST) 2013 Tech Symposium on Bottom Termination Components (BTC), September 25 in South Barrington, IL.
Sandy-Smith’s presentation, Minimizing Voiding in BTC Assembly, reviews proven approaches to minimize BTC voiding, including solder paste optimization, process modifications, and the addition of engineered solder preforms.
Sandy-Smith serves as a technical liaison between Indium Corporation’s customers and internal departments, such as research and development and production, to ensure that customers have the best quality and selection of products. She earned degrees in chemical engineering, with a focus on materials, and German language from the international engineering program at the University of Rhode Island.
BEST is a supplier of PCB rework and repair services, serving communications, computer, industrial, automotive, avionic, and military markets. In addition, BEST is a master IPC-certified training center, certifying students and instructors in J-STD-001, IPC-610, and IPC 7711 and 7721 material. BEST has developed a variety of PCB rework and repair products.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Elektronik-, Halbleiter-, Solar-, Dünnschicht- und Wärmemanagementmärkte. Zu den Produkten gehören Lote, Vorformlinge und Flussmittel, Hartlote, Sputtertargets, Indium-, Gallium- und Germaniummetalle und anorganische Verbindungen sowie NanoFoil®. Indium wurde 1934 gegründet und verfügt über einen weltweiten technischen Support und Fabriken in China, Singapur, Südkorea, Großbritannien und den USA.
Weitere Informationen über die Indium Corporation finden Sie unter www.indium.com oder per E-Mail an [email protected].
