Indium Corporation’s Brook Sandy-Smith, Product Support Specialist – PCB Assembly Materials, will present at the Business Electronic Soldering Technologies (BEST) 2013 Tech Symposium on Bottom Termination Components (BTC), September 25 in South Barrington, IL.
Sandy-Smith’s presentation, Minimizing Voiding in BTC Assembly, reviews proven approaches to minimize BTC voiding, including solder paste optimization, process modifications, and the addition of engineered solder preforms.
Sandy-Smith serves as a technical liaison between Indium Corporation’s customers and internal departments, such as research and development and production, to ensure that customers have the best quality and selection of products. She earned degrees in chemical engineering, with a focus on materials, and German language from the international engineering program at the University of Rhode Island.
BEST is a supplier of PCB rework and repair services, serving communications, computer, industrial, automotive, avionic, and military markets. In addition, BEST is a master IPC-certified training center, certifying students and instructors in J-STD-001, IPC-610, and IPC 7711 and 7721 material. BEST has developed a variety of PCB rework and repair products.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, la energía solar, la capa fina y la gestión térmica. Sus productos incluyen soldaduras, preformas y fundentes; soldaduras fuertes; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio y germanio; y NanoFoil®. Fundada en 1934, Indium cuenta con asistencia técnica mundial y fábricas en China, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
Para más información sobre Indium Corporation, visite www.indium.com o envíe un correo electrónico a [email protected].
