Indium Corporation’s Brook Sandy-Smith, Product Support Specialist – PCB Assembly Materials, will present at the Business Electronic Soldering Technologies (BEST) 2013 Tech Symposium on Bottom Termination Components (BTC), September 25 in South Barrington, IL.
Sandy-Smith’s presentation, Minimizing Voiding in BTC Assembly, reviews proven approaches to minimize BTC voiding, including solder paste optimization, process modifications, and the addition of engineered solder preforms.
Sandy-Smith serves as a technical liaison between Indium Corporation’s customers and internal departments, such as research and development and production, to ensure that customers have the best quality and selection of products. She earned degrees in chemical engineering, with a focus on materials, and German language from the international engineering program at the University of Rhode Island.
BEST is a supplier of PCB rework and repair services, serving communications, computer, industrial, automotive, avionic, and military markets. In addition, BEST is a master IPC-certified training center, certifying students and instructors in J-STD-001, IPC-610, and IPC 7711 and 7721 material. BEST has developed a variety of PCB rework and repair products.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더, 프리폼 및 플럭스, 브레이즈, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인디엄 코퍼레이션에 대한 자세한 내용은 www.indium.com 또는 이메일 [email protected] 에서 확인하세요.
