Indium Corporation’s Mario Scalzo, Senior Technical Support Engineer, will present at the Surface Mount Technology Association’s Ohio Valley Expo and Tech Forum, July 11 in Independence, Ohio.
Scalzo’s presentation, Effects of Thermal Pad Patterning on QFN Voiding, discusses the major challenge of eliminating voids underneath low standoff components. This presentation explores what causes voiding and presents results to help optimize thermal performance and reliability.
Scalzo holds a bachelor’s degree in chemistry from Saint Anselm College and a certificate from the American Chemical Society for Professional Education. He is an SMTA-Certified Process Engineer and earned his Six Sigma Black Belt from the Thayer School of Engineering at Dartmouth College. Scalzo is the author of the Electronics Assembly Materials blog, https://www.indium.com/blogs/Mario-Scalzo-Blog/.
The SMTA Ohio Valley chapter is one in a network of chapters across the United States, South America, the Middle East, and Asia. The volunteer officers and leaders of SMTA local chapters plan events serving regional networks of industry professionals. For more information on upcoming expos, visit www.smta.org/expos.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Elektronik-, Halbleiter-, Solar-, Dünnschicht- und Wärmemanagementmärkte. Zu den Produkten gehören Lote, Vorformlinge und Flussmittel, Hartlote, Sputtertargets, Indium-, Gallium- und Germaniummetalle und anorganische Verbindungen sowie NanoFoil®. Indium wurde 1934 gegründet und verfügt über einen weltweiten technischen Support und Fabriken in China, Singapur, Südkorea, Großbritannien und den USA.
Weitere Informationen über die Indium Corporation erhalten Sie unter www.indium.com oder per E-Mail an [email protected].
