Indium Corporation’s Mario Scalzo, Senior Technical Support Engineer, will present at the Surface Mount Technology Association’s Ohio Valley Expo and Tech Forum, July 11 in Independence, Ohio.
Scalzo’s presentation, Effects of Thermal Pad Patterning on QFN Voiding, discusses the major challenge of eliminating voids underneath low standoff components. This presentation explores what causes voiding and presents results to help optimize thermal performance and reliability.
Scalzo holds a bachelor’s degree in chemistry from Saint Anselm College and a certificate from the American Chemical Society for Professional Education. He is an SMTA-Certified Process Engineer and earned his Six Sigma Black Belt from the Thayer School of Engineering at Dartmouth College. Scalzo is the author of the Electronics Assembly Materials blog, https://www.indium.com/blogs/Mario-Scalzo-Blog/.
The SMTA Ohio Valley chapter is one in a network of chapters across the United States, South America, the Middle East, and Asia. The volunteer officers and leaders of SMTA local chapters plan events serving regional networks of industry professionals. For more information on upcoming expos, visit www.smta.org/expos.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料、預成型品和助熔劑；銅钎；濺鍍靶材；铟、鎵和锗金屬和無機化合物；以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠位於中國、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
