Indium Corporation’s Mario Scalzo, Senior Technical Support Engineer, will present at the Surface Mount Technology Association’s Ohio Valley Expo and Tech Forum, July 11 in Independence, Ohio.
Scalzo’s presentation, Effects of Thermal Pad Patterning on QFN Voiding, discusses the major challenge of eliminating voids underneath low standoff components. This presentation explores what causes voiding and presents results to help optimize thermal performance and reliability.
Scalzo holds a bachelor’s degree in chemistry from Saint Anselm College and a certificate from the American Chemical Society for Professional Education. He is an SMTA-Certified Process Engineer and earned his Six Sigma Black Belt from the Thayer School of Engineering at Dartmouth College. Scalzo is the author of the Electronics Assembly Materials blog, https://www.indium.com/blogs/Mario-Scalzo-Blog/.
The SMTA Ohio Valley chapter is one in a network of chapters across the United States, South America, the Middle East, and Asia. The volunteer officers and leaders of SMTA local chapters plan events serving regional networks of industry professionals. For more information on upcoming expos, visit www.smta.org/expos.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、太陽電池、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだ、プリフォーム、フラックス、ろう材、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウムの金属および無機化合物、NanoFoil®などがある。1934年に設立されたインジウムは、グローバルな技術サポートと中国、シンガポール、韓国、英国、米国に工場を有しています。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
