Indium Corporation's Dr. Ron Lasky, Senior Technologist, and Eric Bastow, Assistant Technical Manager for the Americas, will present at the 2017 SMTA Puget Sound Symposium and Supplier Day on May 8 in Redmond, Wash.
Lasky's presentation, Minimizing Voiding in SMT Assembly of BTCs, reviews proven approaches to minimize voiding in bottom termination components, including solder paste optimization, process modifications, and the addition of solder preforms.
Bastow's presentation, Package-on-Package for 3D Packaging, discusses the pros and cons of the two common PoP designs and the various interconnect materials and processes that are used to stack them. It will also cover various parameters to optimize the PoP assembly process.
Dr. Lasky, holder of the prestigious SMTA Founder's Award, is a world-renowned process expert and a Senior Technologist at Indium Corporation. He is also a Professor of Engineering and the Director of the Cook Engineering Design Center at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronic packaging and assembly. Dr. Lasky has authored six books, and contributed to nine more on science, electronics, and optoelectronics. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry, worldwide. Dr. Lasky also authors a technology blog, which can be found at indiumstg.wpenginepowered.com/drlasky.
Bastow provides technical support for Indium Corporation's full range of solder products for the electronics assembly, semiconductor packaging, and thermal management markets to customers throughout the Americas. He is an SMTA-certified process engineer and has earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, Hanover, NH.
Die SMTA ist ein internationales Netzwerk von Fachleuten, die ihre Fähigkeiten ausbauen, praktische Erfahrungen austauschen und Lösungen im Bereich der elektronischen Montagetechnologien, einschließlich Mikrosysteme, neue Technologien und damit verbundene Geschäftsabläufe, entwickeln.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Märkte der Elektronik-, Halbleiter-, Dünnschicht- und Wärmemanagementindustrie. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
