Indium Corporation's Dr. Ron Lasky, Senior Technologist, and Eric Bastow, Assistant Technical Manager for the Americas, will present at the 2017 SMTA Puget Sound Symposium and Supplier Day on May 8 in Redmond, Wash.
Lasky's presentation, Minimizing Voiding in SMT Assembly of BTCs, reviews proven approaches to minimize voiding in bottom termination components, including solder paste optimization, process modifications, and the addition of solder preforms.
Bastow's presentation, Package-on-Package for 3D Packaging, discusses the pros and cons of the two common PoP designs and the various interconnect materials and processes that are used to stack them. It will also cover various parameters to optimize the PoP assembly process.
Dr. Lasky, holder of the prestigious SMTA Founder's Award, is a world-renowned process expert and a Senior Technologist at Indium Corporation. He is also a Professor of Engineering and the Director of the Cook Engineering Design Center at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronic packaging and assembly. Dr. Lasky has authored six books, and contributed to nine more on science, electronics, and optoelectronics. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry, worldwide. Dr. Lasky also authors a technology blog, which can be found at indiumstg.wpenginepowered.com/drlasky.
Bastow provides technical support for Indium Corporation's full range of solder products for the electronics assembly, semiconductor packaging, and thermal management markets to customers throughout the Americas. He is an SMTA-certified process engineer and has earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, Hanover, NH.
SMTA是一個由專業人士組成的國際網絡，他們在電子組裝技術（包括微系統、新興技術和相關業務運作）方面建立技能、分享實踐經驗和開發解決方案。
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
