Indium Corporation will feature its Indium3.2HF Solder Paste at the 14th International Wafer-Level Packaging Conference (IWLPC 2017—Silicon to Systems), Oct. 24-26, in San Jose, Calif.
Indium Corporation’s Indium3.2HF is an air or nitrogen reflow, water-soluble solder paste specifically formulated for fine feature printing applications (Type 6SG).
Indium3.2HF is formulated to offer consistent, repeatable printing performance combined with a long stencil life. In addition, Indium3.2HF delivers:
- Buena respuesta a la pausa
- Una amplia ventana de perfil de reflujo
- Excelente resistencia al desprendimiento
- Excelente capacidad humectante
- Capacidad superior de soldadura de paso fino
From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP applications.
For more information on Indium Corporation’s materials for SiP or Indium3.2HF Solder Paste, go to indiumstg.wpenginepowered.com/SiP or visit Indium Corporation’s booth 39.
Para obtener más información sobre Indium Corporation, visitaindiumstg.wpenginepowered.como envía un correo electrónicoa [email protected]. También puedes seguir a nuestros expertos, From One Engineer ToAnother®(#FOETA), enwww.facebook.com/indiumo en@IndiumCorp.
