Indium Corporation’s Indium6.4R is a versatile, water-soluble solder paste flux that enables a low cost of ownership for PCB assembly customers through an all-around, balanced performance.
Available in both SAC and Pb-based alloys, Indium6.4R achieves superior stencil printing performance and demonstrates excellent response-to-pause.
“Indium6.4R is the recommended water-soluble paste for most applications because it outperforms other pastes in all categories,” said Glen Thomas, product manager, PCB solder paste. “This paste allows for wetting and solderability on multiple surface finishes; results in low voiding on QFNs, BGAs, and CSPs; and maintains tack over time at various humidity levels.”
For more information about Indium6.4R, including technical papers and other technical information, visit indiumstg.wpenginepowered.com/indium6.4R.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, la capa fina, la gestión térmica y la energía solar. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil®. Fundada en 1934, Indium cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
