Indium Corporation’s Indium6.4R is a versatile, water-soluble solder paste flux that enables a low cost of ownership for PCB assembly customers through an all-around, balanced performance.
Available in both SAC and Pb-based alloys, Indium6.4R achieves superior stencil printing performance and demonstrates excellent response-to-pause.
“Indium6.4R is the recommended water-soluble paste for most applications because it outperforms other pastes in all categories,” said Glen Thomas, product manager, PCB solder paste. “This paste allows for wetting and solderability on multiple surface finishes; results in low voiding on QFNs, BGAs, and CSPs; and maintains tack over time at various humidity levels.”
For more information about Indium6.4R, including technical papers and other technical information, visit indiumstg.wpenginepowered.com/indium6.4R.
Indium Corporation 是全球電子、半導體、薄膜、熱管理和太陽能市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
