Indium Corporation and the Empire Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS), in association with the State University of New York (SUNY), will host an Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging on Sept. 24 at SUNY Polytechnic Institute in Marcy, N.Y.
The world of semiconductor packaging has never been more diverse or more complex. Join leading experts to discuss solutions to current and emerging challenges in assembly processes, materials, and reliability, as well as packaging technology advances.
This event will cover advanced topics including wafer bumping, flip-chip, TSVs, 3D assembly, wire-bonded packages, and MEMS devices.
Early registration ends on Aug. 21. To register for the event, visit www.imaps.org/asp.
Upstate New York is now a major hub for semiconductor fabrication and assembly, and is a beautiful and exciting location at the forefront of major technology advances and electronics industry growth.
IMAPS is the world's largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, la energía solar, la capa fina y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil®. Fundada en 1934, Indium cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
Para más información sobre Indium Corporation, visite www.indium.com o envíe un correo electrónico a [email protected]. También puede seguir a nuestros expertos, From One Engineer To Another® (#FOETA), en www.facebook.com/indium o @IndiumCorp.
