Indium Corporation and IMAPS Empire Chapter to Host "Advances in Semiconductor Packaging" Workshop in September

Indium Corporation and IMAPS Empire Chapter to Host “Advances in Semiconductor Packaging” Workshop in September

Indium Corporation and the Empire Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS), in association with the State University of New York (SUNY), will host an Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging on Sept. 24 at SUNY Polytechnic Institute in Marcy, N.Y.

The world of semiconductor packaging has never been more diverse or more complex. Join leading experts to discuss solutions to current and emerging challenges in assembly processes, materials, and reliability, as well as packaging technology advances.

This event will cover advanced topics including wafer bumping, flip-chip, TSVs, 3D assembly, wire-bonded packages, and MEMS devices.

Early registration ends on Aug. 21. To register for the event, visit www.imaps.org/asp.

Upstate New York is now a major hub for semiconductor fabrication and assembly, and is a beautiful and exciting location at the forefront of major technology advances and electronics industry growth.

IMAPS is the world's largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.

インジウム・コーポレーションは、世界のエレクトロニクス、半導体、太陽電池、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、^NanoFoil®などがあります。1934年に設立されたインジウムは、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を有しています。

インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、[email protected] まで電子メールでお問い合わせください。また、当社の専門家であるFrom One Engineer To^Another®(#FOETA)を、www.facebook.com/indiumまたは@IndiumCorp でフォローすることもできます。