Indium Corporation and the Empire Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS), in association with the State University of New York (SUNY), will host an Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging on Sept. 24 at SUNY Polytechnic Institute in Marcy, N.Y.
The world of semiconductor packaging has never been more diverse or more complex. Join leading experts to discuss solutions to current and emerging challenges in assembly processes, materials, and reliability, as well as packaging technology advances.
This event will cover advanced topics including wafer bumping, flip-chip, TSVs, 3D assembly, wire-bonded packages, and MEMS devices.
Early registration ends on Aug. 21. To register for the event, visit www.imaps.org/asp.
Upstate New York is now a major hub for semiconductor fabrication and assembly, and is a beautiful and exciting location at the forefront of major technology advances and electronics industry growth.
IMAPS is the world's largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.
Indium Corporation 是全球电子、半导体、太阳能、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。Indium 公司成立于 1934 年，在中国、马来西亚、新加坡、韩国、英国和美国拥有全球性的技术支持和工厂。
有关 Indium Corporation 的更多信息，请访问www.indium.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家 From One Engineer ToAnother®(#FOETA) 。
