Indium Corporation's Ron Hunadi, Market Development Manager, Semiconductor and Advanced Materials, will share his knowledge and expertise at IMAPS Advanced Technology Workshop and Tabletop Exhibition on Thermal Management, Oct. 25-27, in Los Gatos, Calif.
Hunadi’s presentation, Specialized Metallic TIMs for Non-Flat Surfaces and Burn-in/Test Applications, discusses the development of improved thermal interface materials (TIMs) that are cost-effective for both TIM2 and burn-in test applications.
Hunadi’s presentation includes a review of thermal and performance data on HSMF and HSMF-OS. HSMF is a unique multilayer TIM that accommodates surface warpage over large areas, facilitates effective heat removal, and minimizes hot spots. HSMF-OS is a 4-mil thick composition that contains an aluminum layer and a unique non-silicone thermal compound.
Hunadi has more than 20 years of experience in business development and microelectronics. He is responsible for developing new business opportunities and works closely with Indium Corporation's field sales and technical teams in Asia and the USA.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, la capa fina, la gestión térmica y la energía solar. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil®. Fundada en 1934, Indium cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
