Indium Corporation's Ron Hunadi, Market Development Manager, Semiconductor and Advanced Materials, will share his knowledge and expertise at IMAPS Advanced Technology Workshop and Tabletop Exhibition on Thermal Management, Oct. 25-27, in Los Gatos, Calif.
Hunadi’s presentation, Specialized Metallic TIMs for Non-Flat Surfaces and Burn-in/Test Applications, discusses the development of improved thermal interface materials (TIMs) that are cost-effective for both TIM2 and burn-in test applications.
Hunadi’s presentation includes a review of thermal and performance data on HSMF and HSMF-OS. HSMF is a unique multilayer TIM that accommodates surface warpage over large areas, facilitates effective heat removal, and minimizes hot spots. HSMF-OS is a 4-mil thick composition that contains an aluminum layer and a unique non-silicone thermal compound.
Hunadi has more than 20 years of experience in business development and microelectronics. He is responsible for developing new business opportunities and works closely with Indium Corporation's field sales and technical teams in Asia and the USA.
Indium Corporation 是全球電子、半導體、薄膜、熱管理和太陽能市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
