Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring®and HSMF-OS, at TestConX on March 3-6 in Mesa, Ariz.
A pure indium Heat-Spring®in the HSK pattern can be clad on one side with a thin layer of aluminum, which will prevent the indium from sticking to the device under test (DUT). Due to the thinness of the aluminum, it has minimal impact on the thermal conductivity of the indium.
HSMF-OS has a multi-layer construction with a total thickness of 0.004” that is designed for multiple insertions. It has an aluminum layer that acts as an interface with the DUT and has a tensile strength of approximately 90 MPa with a soft, compliant polymer backing. This unique construction results in a configuration with “designed-in” insertion survivability.
To learn more about Indium Corporation’s metal thermal interface materials for burn-in and test, visit indiumstg.wpenginepowered.com/BiTS.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes, soldaduras fuertes, materiales de interfaz térmica, cátodos para sputtering, metales y compuestos inorgánicos de indio, galio, germanio y estaño, y NanoFoil®. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another®(#FOETA), at www.facebook.com/indium or @IndiumCorp.
