Indium Corporation will feature its new technology platform using SACm™ solder paste at APEX March 25-27 in Las Vegas, Nevada.
SACm™ is a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling. SACm™ is doped with manganese and contains less silver than other Pb-free solder pastes. The manganese provides increased strength and the reduced silver content provides a more stable cost structure, especially beneficial for cost-sensitive applications.
The platform consists of Indium8.9 Series solder pastes using Indium Corporation’s patent-pending SACm™ solder paste technology for board-side interconnect, and SACm™ solder balls (spheres) for package-level interconnect.
La pasta de soldar Indium8.9HF sin halógenos ni Pb es uno de los vehículos de fundente estándar para SACm™. Indium8.9HF proporciona un excelente rendimiento de soldadura en procesos de alta temperatura y reflujo prolongado. Ofrece una eficacia de transferencia de impresión de esténciles sin precedentes para trabajar en la más amplia gama de procesos.
Indium Corporation will be exhibiting at booth 1977.
For more information about Indium Corporation’s SACm™ solder paste, visit indiumstg.wpenginepowered.com/SACm or email [email protected].
