Indium Corporation will feature its new technology platform using SACm™ solder paste at APEX March 25-27 in Las Vegas, Nevada.
SACm™ is a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling. SACm™ is doped with manganese and contains less silver than other Pb-free solder pastes. The manganese provides increased strength and the reduced silver content provides a more stable cost structure, especially beneficial for cost-sensitive applications.
The platform consists of Indium8.9 Series solder pastes using Indium Corporation’s patent-pending SACm™ solder paste technology for board-side interconnect, and SACm™ solder balls (spheres) for package-level interconnect.
Indium8.9HF 無鹵素、無鉛焊膏是 SACm™ 的標準助焊劑材之一。Indium8.9HF 在高溫和長時間回流焊製程中提供優異的焊接效能。它提供前所未有的鋼版印刷傳輸效率，可應用於最廣泛的製程。
Indium Corporation will be exhibiting at booth 1977.
如需瞭解 Indium Corporation SACm™ 焊膏的更多資訊，請造訪www.indium.com/SACm或發送電子郵件至 [email protected]。
