Indium Corporation technology experts will share their expertise at the 47th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) Oct. 14-16 in San Diego, Calif.
Dr. Ning-Cheng Lee, vice president of technology, will present Low-Porosity Pressureless Sintering of a Novel Ag Paste for Die-Attach. This presentation discusses Ag paste as the answer to the challenges of service temperature, thermal conductivity, electrical conductivity, and reliability in high-power devices. A discussion of the morphology and reliability of the sintered joint will be included.
Dr. Lee will also present Reliability of PCB Solder Joints Assembled with SACm™0510 Solder Paste. In this presentation, Dr. Lee examines the superior performance of SACm0510 when used as solder paste, compared to SAC305. Performance issues, including the evaluation of drop test performance, TCT reliability, and solder joint microstructure, will be explored.
Additionally, Dr. Lee will teach a professional development course titled Package-on-Package Technology – What It Is, What Works, and What Doesn’t Work. This course will review package-on-package (PoP) technology topics including trends, designs, materials selection, processes, and reliability.
Maria Durham, product specialist – semiconductor and advanced assembly materials, will co-chair the Bonding Materials and Processes session, which will focus on materials used in through-silicon via (TSV) bonding and wire bonding.
IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. The 47th Symposium on Microelectronics will cover three tiers of electronics: systems and applications; design and related measurements; and materials, process, and reliability. Indium Corporation will be exhibiting at booth 217. For more information, visit www.imaps.org/imaps2014.
El Dr. Lee es un experto en soldadura de renombre mundial y miembro distinguido de la SMTA. Tiene una amplia experiencia en el desarrollo de polímeros de alta temperatura, encapsulantes para microelectrónica, rellenos y adhesivos. Sus intereses de investigación actuales incluyen materiales avanzados para interconexiones y envasado para aplicaciones electrónicas y optoelectrónicas, con énfasis tanto en el alto rendimiento como en el bajo coste de propiedad.
Durham serves as a technical liaison between Indium Corporation’s customers and internal departments, such as sales, technical support, research and development, and operations to guarantee the best quality and selection of products. She earned her bachelor’s degree in Physics and Applied Mathematics from Clarkson University in Potsdam, N.Y. While at Clarkson, she worked as a McNair Scholar performing research in electro-chemical deposition.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, la energía solar, la capa fina y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil®. Fundada en 1934, Indium cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
