Indium Corporation will feature its new high-performance, high-reliability alloy technology at PCB Carolina on November 13 in Raleigh, North Carolina, USA.
Durafuse™ LT is a novel, low-temperature alloy system designed to provide high-reliability in low applications that are looking for a reflow temperature below 210°C. Where traditional low-temperature solders often produce brittle solder joints that are susceptible to drop shock failures, Durafuse LT offers improved drop shock resilience, outclassing BiSn or BiSnAg alloys, and even performs better than SAC305 with optimum process setup. Durafuse LT:
- Proporciona una solución para componentes sensibles al calor y polímeros flexibles
- Evita el alabeo térmico de los componentes del procesador y las placas multicapa.
- Meets low temperature requirements for step soldering, particularly in RF shield attachment and rework applications
To learn more about Indium Corporation’s innovative low-temperature technology, stop by booth #76 or reach out to our Technical Support Engineers at [email protected].
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes, soldaduras fuertes, materiales de interfaz térmica, cátodos para sputtering, metales y compuestos inorgánicos de indio, galio, germanio y estaño, y NanoFoil®. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, India, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
