Indium Corporation will feature products from its portfolio of system-in-package material solutions at the Advanced System in Package Technology Conference & Exhibition, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), on Tuesday, June 21 in Sonoma, Calif., U.S.
From water-soluble to no-clean soldering solutions, flip-chip fluxes, and novel mixed alloy technologies, Indium Corporations portfolio of products meets current and evolving challenges encountered in fine-pitch SiP and heterogeneous integration and assembly (HIA) applications.
Indium Corporations proven SiPaste series is specifically designed for fine-feature printing with fine powders ranging from Type 5 to Type 7. They help Avoid the Void, reduce slumps, and demonstrate consistent superior printing performance. Water-soluble SiPaste 3.2HF has been adopted by leading OSATs and has been used in more than 5 billion mobile FEM SiP modules. SiPaste C201HF offers the same superior printing performance with the benefit of having a cleanable chemistry with semi-aqueous-based solutions.
SiPaste 3.2HF formulation offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of todays miniaturization in SiP design. In addition to consistent printing and reflow requirements, this solder paste offers superb wetting to the various Pb-free metallizations and has exceptional low-voiding performance on fine-pitch components, including BGAs and CSPs.
- Exceptional printing
- Long stencil life
- Buena respuesta a la pausa
- Wide reflow profile window
- Excelente resistencia al desprendimiento
- Excelente capacidad humectante
- Capacidad superior de soldadura de paso fino
- Low-voiding
- Halogen-free
SiPaste C201HF exhibits many of these same benefits, with particular formulation consideration to provide exceptional paste release on sub-80-micron apertures, stable print performance leading to long stencil life, and high tackiness to prevent component shift. This combines with a cleanable chemistry with semi-aqueous-based solutions, allowing for ease of cleaning with minimal cost.
Acerca de Indium Corporation
Indium Corporation es un importante refinador, fundidor, fabricante y proveedor de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, Alemania, India, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
About iMAPS SiP
IMAPS has established the Advanced System-in-Package Conference & Exhibition to focus exclusively on innovative SiP technology developments, solutions, and business trends. Advanced SiP 2022 will be a high-end event that combines the IMAPS System-in Package Conference and the 3D ASIP Conference (recognized as the premier conference on 2.5/3D ICs, focused on commercialization and infrastructure). Advanced SiP 2022 will offer cutting-edge presentations from scientists, technologists, and business leaders across the globe in cellular, IoT, automotive, computing, and networking market segments.
